SLASFB5 May   2024 MSPM0L1228-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 High Frequency Crystal/Clock
      4. 7.10.4 Low Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characteristics (ADC)
      4. 7.15.4 Voltage Characteristics (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0Lx22x)
    3. 8.3  Security
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 LFSS
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 TRNG
    19. 8.19 AESADV
    20. 8.20 Keystore
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 IWDT
    26. 8.26 WWDT
    27. 8.27 RTC_A
    28. 8.28 Timers (TIMx)
    29. 8.29 LCD
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

8.27 RTC_A

The RTC_A instance of the real-time clock operates off of a 32kHz input clock source (typically a low frequency crystal) and provides a time base to the application with multiple options for interrupts to the CPU. RTC_A provides common key features in relation to the Low-Frequency Subsystem (LFSS).

Common key features of RTC_A include:

  • Counters for seconds, minutes, hours, day of the week, day of the month, month, and year
  • Binary or BCD format
  • Leap-year handling
  • One customizable alarm interrupt based on minute, hour, day of the week, and day of the month
  • Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon
  • Interval alarm interrupt providing periodic wake-up at 4096, 2048, 1024, 512, 256, or 128Hz
  • Interval alarm interrupt providing periodic wake-up at 64, 32, 16, 8, 4, 2, 1, and 0.5Hz
  • Calibration for crystal offset error (up to ±240ppm)
  • Compensation for temperature drift (up to ±240ppm)
  • RTC clock output to pin for calibration
  • Three bit prescaler for heartbeat function with interrupt generation
  • RTC external clock selection of untrimmed 32kHz, trimmed 512Hz, 256Hz, or 1Hz
  • RTC time stamp capture upon detection of a timer stamp event, including tamper (TIO) event and VDD fail event
  • RTC counter lock function

Table 8-10 shows the RTC features supported in this device.

Table 8-10 RTC Instances and Key Features
RTC Features RTC_A
Power enable register -
Real-time clock and calendar mode providing seconds, minutes, hours, day of week, day of month, and year Yes
Selectable binary or binary-coded decimal (BCD) format Yes
Leap-year correction (valid for year 1901 through 2099) Yes
Two customizable calendar alarm interrupts based on minute, hour, day of the week, and day of the month Yes
Interval alarm interrupt to wake every minute, every hour, at midnight, or at noon Yes
Periodic interrupt to wake at 4096, 2048, 1024, 512, 256, or 128Hz Yes
Periodic interrupt to wake at 64, 32, 16, 8, 4, 2, 1, and 0.5Hz Yes
Interrupt capability down to STANDBY mode with STOPCLKSTBY Yes
Calibration for crystal offset error and crystal temperature drift (up to ±240ppm total) Yes
RTC clock output to pin for calibration (GPIO) Yes
RTC clock output to pin for calibration (TIO) Yes
Three bit prescaler for heartbeat function with interrupt generation Yes
RTC external clock selection of untrimmed 32kHz, trimmed 512Hz, 256Hz or 1Hz Yes
RTC time stamp capture upon detection of a timer stamp event, including:
  • TIO event
  • VDD fail event
 Yes
RTC counter lock function Yes

For more details, see the RTC chapter of the MSPM0 L-Series 32MHz Microcontrollers Technical Reference Manual`.