SLASFB5 May   2024 MSPM0L1228-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Device Comparison Chart
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
    3. 6.3 Signal Descriptions
      1.      13
      2.      14
      3.      15
      4.      16
      5.      17
      6.      18
      7.      19
      8.      20
      9.      21
      10.      22
      11.      23
      12.      24
      13.      25
      14.      26
      15.      27
      16.      28
      17.      29
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
    7. 7.7  VBat Characteristics
    8. 7.8  Flash Memory Characteristics
    9. 7.9  Timing Characteristics
    10. 7.10 Clock Specifications
      1. 7.10.1 System Oscillator (SYSOSC)
      2. 7.10.2 Low Frequency Oscillator (LFOSC)
      3. 7.10.3 High Frequency Crystal/Clock
      4. 7.10.4 Low Frequency Crystal/Clock
    11. 7.11 Digital IO
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
    12. 7.12 Analog Mux VBOOST
    13. 7.13 ADC
      1. 7.13.1 Electrical Characteristics
      2. 7.13.2 Switching Characteristics
      3. 7.13.3 Linearity Parameters
      4. 7.13.4 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Electrical Characteristics ADC
      2. 7.15.2 Electrical Characteristics (Comparator)
      3. 7.15.3 Voltage Characteristics (ADC)
      4. 7.15.4 Voltage Characteristics (Comparator)
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 LCD
    18. 7.18 I2C
      1. 7.18.1 I2C Characteristics
      2. 7.18.2 I2C Filter
      3. 7.18.3 I2C Timing Diagram
    19. 7.19 SPI
      1. 7.19.1 SPI
      2. 7.19.2 SPI Timing Diagram
    20. 7.20 UART
    21. 7.21 TIMx
    22. 7.22 TRNG
      1. 7.22.1 TRNG Electrical Characteristics
      2. 7.22.2 TRNG Switching Characteristics
    23. 7.23 Emulation and Debug
      1. 7.23.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0Lx22x)
    3. 8.3  Security
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 LFSS
    16. 8.16 VREF
    17. 8.17 COMP
    18. 8.18 TRNG
    19. 8.19 AESADV
    20. 8.20 Keystore
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 IWDT
    26. 8.26 WWDT
    27. 8.27 RTC_A
    28. 8.28 Timers (TIMx)
    29. 8.29 LCD
    30. 8.30 Device Analog Connections
    31. 8.31 Input/Output Diagrams
    32. 8.32 Serial Wire Debug Interface
    33. 8.33 Bootstrap Loader (BSL)
    34. 8.34 Device Factory Constants
    35. 8.35 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

7.13.1 Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted), all TYP values are measured at 25℃ and all accuracy parameters are measured using 12-bit resolution mode (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Vin(ADC) Analog input voltage range(1) Applies to all ADC analog input pins 0 VDD V
VR+ Positive ADC reference voltage VR+ sourced from VDD VDD V
VR+ sourced from external reference pin (VREF+) 1.4 VDD V
VR+ sourced from internal reference (VREF) VREF V
VR- Negative ADC reference voltage 0 V
FS ADC sampling frequency  RES = 0x0 (12-bit mode), External Reference 1.68 Msps
I(ADC)(2) Operating supply current
into VDD terminal 		 FS = 1.68MSPS, Internal reference OFF, VR+ = VDD 460 600 μA
FS = 200ksps, Internal reference ON, VR+ = VREF = 2.5V 300 435
CS/H ADC sample-and-hold capacitance 3.3 pF
Rin ADC input resistance 0.5 kΩ
ENOB Effective number of bits External reference (3) 11.0 11.1 bit
Internal reference, VR+ = VREF = 2.5V  10 10.2
SNR Signal-to-noise ratio External reference (3) 68 71 dB
Internal reference, VR+ = VREF = 2.5V  63 65
PSRRDC Power supply rejection ratio, DC External reference (3), VDD = VDD(min) to VDD(max) 63 68 dB
VDD = VDD(min) to VDD(max)
Internal reference, VR+ = VREF = 2.5V 		 49 55
PSRRAC Power supply rejection ratio, AC External reference (3), ΔVDD = 0.1V at 1kHz 61 dB
ΔVDD = 0.1V at 1kHz
Internal reference, VR+ = VREF = 2.5V 		 49
Twakeup ADC Wakeup Time Assumes internal reference is active 5 us
VSupplyMon Supply Monitor voltage divider (VDD/3) accuracy ADC input channel: Supply Monitor(4) -1.5 +1.5 %
ISupplyMon Supply Monitor voltage divider current consumption ADC input channel: Supply Monitor 10 µA
VSupplyMon Supply Monitor voltage divider (VBAT/3) accuracy ADC input channel: Supply Monitor(4) -1.5 +1.5 %
ISupplyMon Supply Monitor voltage divider current consumption ADC input channel: Supply Monitor 10 µA
(1) The analog input voltage range must be within the selected ADC reference voltage range VR+ to VR– for valid conversion results.
(2) The internal reference (VREF) supply current is not included in current consumption parameter I(ADC).
(3) All external reference specifications are measured with VR+ = VREF+ = VDD = 3.3V and VR- = VREF- = VSS = 0V and external 1uF cap on VREF+ pin
(4) Analog power supply monitor. Analog input on channel 31 for VDD monitor and channel 30 for VBAT monitor is disconnected and is internally connected to the voltage divider which is VDD/3. Both the supply monitors are measured with external reference