SLASEX0D October 2022 – January 2024 MSPM0L1303 , MSPM0L1304 , MSPM0L1305 , MSPM0L1306 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | PACKAGE | VALUE | UNIT | |
---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance | VQFN-32 (RHB) | 36.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 28.5 | °C/W | |
RθJB | Junction-to-board thermal resistance | 17.2 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 0.8 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 17.2 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.9 | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VSSOP-28 (DGS28) | 78.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 38.6 | °C/W | |
RθJB | Junction-to-board thermal resistance | 41.3 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 3.4 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 41.0 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VQFN-24 (RGE) | 44.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 38.1 | °C/W | |
RθJB | Junction-to-board thermal resistance | 21.9 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 1.1 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 21.9 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 7.1 | °C/W | |
RθJA | Junction-to-ambient thermal resistance | VSSOP-20 (DGS20) | 91.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.3 | °C/W | |
RθJB | Junction-to-board thermal resistance | 48.3 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 0.7 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 47.9 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | WQFN-16 (RTR) | 100.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 43.2 | °C/W | |
RθJB | Junction-to-board thermal resistance | 47.4 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 2.1 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 47.2 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |
RθJA | Junction-to-ambient thermal resistance | SOT-16 (DYY) | 86.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 39.3 | °C/W | |
RθJB | Junction-to-board thermal resistance | 27.8 | °C/W | |
ΨJT | Junction-to-top characterization parameter | 1.1 | °C/W | |
ΨJB | Junction-to-board characterization parameter | 27.8 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |