SLASED9C November   2016  – October 2019 MUX36D08 , MUX36S16

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Leakage Current vs Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions, MUX36S16
    2.     Pin Functions: MUX36D08
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Dual Supply
    6. 6.6 Electrical Characteristics: Single Supply
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Truth Tables
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off Leakage
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Differential On-Leakage Current
      5. 7.1.5  Transition Time
      6. 7.1.6  Break-Before-Make Delay
      7. 7.1.7  Turn-On and Turn-Off Time
      8. 7.1.8  Charge Injection
      9. 7.1.9  Off Isolation
      10. 7.1.10 Channel-to-Channel Crosstalk
      11. 7.1.11 Bandwidth
      12. 7.1.12 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultralow Leakage Current
      2. 8.3.2 Ultralow Charge Injection
      3. 8.3.3 Bidirectional Operation
      4. 8.3.4 Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (April 2018) to C Revision

  • Added BW, THD+N, and CIN rows to the Electrical Characteristics: Dual SupplyGo
  • Changed VDD and VSS supply current MAX values for ±15V supplies in Electrical Characteristics: Dual SupplyGo
  • Changed VDD and VSS supply current MAX values for 12V supplies in Electrical Characteristics: Single SupplyGo

Changes from A Revision (November 2017) to B Revision

  • Added WQFN Package option in FeaturesGo
  • Added Added WQFN package option in Device InformationGo
  • Added pinout information for WQFN packages Go
  • Added data for WQFN packages to Thermal InformationGo

Changes from * Revision (November 2016) to A Revision

  • Changed Transition Time From: 85 ns To: 97ns (Typ) in the Features listGo
  • Added SOIC packages to Feature and Device InformationGo
  • Added the DW (SOIC) package to the Pin Configuration and Functions sectionGo
  • Added SOIC package to the Thermal Information tableGo
  • Changed Transition time Typ value From 85: ns To: 97ns for ±15 V supplies in the Electrical Characteristics: Dual Supply tableGo
  • Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for ±15 V supplies in Electrical Characteristics: Dual SupplyGo
  • Changed Transition time Typ value From: 91 To: 102 ns for 12 V supply in the Electrical Characteristics: Single Supply tableGo
  • Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for 12 V supply in Electrical Characteristics: Single SupplyGo