SLASED9C November   2016  – October 2019 MUX36D08 , MUX36S16

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Leakage Current vs Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions, MUX36S16
    2.     Pin Functions: MUX36D08
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Dual Supply
    6. 6.6 Electrical Characteristics: Single Supply
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Truth Tables
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off Leakage
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Differential On-Leakage Current
      5. 7.1.5  Transition Time
      6. 7.1.6  Break-Before-Make Delay
      7. 7.1.7  Turn-On and Turn-Off Time
      8. 7.1.8  Charge Injection
      9. 7.1.9  Off Isolation
      10. 7.1.10 Channel-to-Channel Crosstalk
      11. 7.1.11 Bandwidth
      12. 7.1.12 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultralow Leakage Current
      2. 8.3.2 Ultralow Charge Injection
      3. 8.3.3 Bidirectional Operation
      4. 8.3.4 Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Figure 46 illustrates an example of a PCB layout with the MUX36S16IPW, and Figure 47 illustrates an example of a PCB layout with MUX36D08IPW.

Some key considerations are:

  1. Decouple the VDD and VSS pins with a 0.1-µF capacitor, placed as close to the pin as possible. Make sure that the capacitor voltage rating is sufficient for the VDD and VSS supplies.
  2. Keep the input lines as short as possible. In case of the differential signal, make sure the A inputs and B inputs are as symmetric as possible.
  3. Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  4. Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.