SBAS758C January   2016  – September 2016 MUX508 , MUX509

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Dual Supply
    6. 7.6 Electrical Characteristics: Single Supply
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  Truth Tables
    2. 8.2  On-Resistance
    3. 8.3  Off-Leakage Current
    4. 8.4  On-Leakage Current
    5. 8.5  Transition Time
    6. 8.6  Break-Before-Make Delay
    7. 8.7  Turn-On and Turn-Off Time
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Channel-to-Channel Crosstalk
    11. 8.11 Bandwidth
    12. 8.12 THD + Noise
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Ultralow Leakage Current
      2. 9.3.2 Ultralow Charge Injection
      3. 9.3.3 Bidirectional Operation
      4. 9.3.4 Rail-to-Rail Operation
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (July 2016) to C Revision

  • Added D (SOIC) package to documentGo
  • Changed last Features bullet to include SOIC packageGo
  • Changed second sentence of Description sectionGo
  • Added SOIC package to Device Information table Go
  • Changed MUX509 description in Device Comparison TableGo
  • Added D package to Pin Configuration and Functions sectionGo
  • Added D package to Thermal Information table Go
  • Changed Analog Switch, ID parameter in Electrical Characteristics: Dual Supply table: split parameter into ID(OFF) and ID(ON) parameters, changed symbols, parameter names, and test conditionsGo
  • Changed On-resistance drift parameter in Electrical Characteristics: Single Supply table: changed VS value in test conditionsGo
  • Changed Analog Switch, ID parameter in Electrical Characteristics: Single Supply table: split parameter into ID(OFF) and ID(ON) parameters, changed symbols, parameter names, and ID(ON) test conditionsGo
  • Changed Figure 26: changed switch symbol to a closed switch symbolGo
  • Changed Figure 32: added 0 V line, flipped VS supply symbolGo
  • Changed description of MUX509 in Overview section Go
  • Changed Figure 42: changed OPA140 amplifier and charge kickback filter boxGo
  • Added D package description to Layout Guidelines sectionGo

Changes from A Revision (March 2016) to B Revision

  • Added TI Design Go
  • Changed Analog Switch, IS(OFF) and ID parameter specifications in Electrical Characteristics: Single Supply tableGo

Changes from * Revision (January 2016) to A Revision

  • Changed from product preview to production dataGo