SLOS099H September   1983  – March 2023 OP07 , OP07C , OP07D

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset-Voltage Null Capability
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Swing
        2. 8.2.2.2 Supply and Input Voltage
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • YS|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20230202-SS0I-VVQV-VKNG-LZ0W7PQWH92X-low.svg Figure 5-1 D Package, 8-Pin SOIC,
P Package, 8-Pin PDIP,
and PS Package, 8-Pin SO
(Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
IN+ 3 Input Noninverting input
IN– 2 Input Inverting input
NC 5 — Do not connect
OFFSET N1 1 Input External input offset voltage adjustment
OFFSET N2 8 Input External input offset voltage adjustment
OUT 6 Output Output
V+ 7 — Positive supply
V– 4 — Negative supply