SBOSAC7A february   2023  – july 2023 OPA1633

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Common-Mode Voltage
        1. 8.1.1.1 Resistor Matching
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations
        2. 8.4.1.2 Power Dissipation and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Excellent sound quality
  • Ultra low distortion: 132 dB
  • Low noise: 1.1 nV/√Hz
  • High speed:
    • Slew rate: 80 V/μs
    • Gain bandwidth product: 200 MHz
  • Fully differential architecture:
    • Balanced input and output converts single-ended input to balanced differential output
  • Wide supply range: ±2.5 V to ±17.5 V
  • Shutdown current: 0.77 mA (VS = ± 5 V)
  • Temperature range: –40°C to +85°C
  • Packages: HVSSOP-8, SOIC-8