SBOS489A December   2011  – December 2024 OPA1662 , OPA1664

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configurations
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA1662
    5. 5.5 Thermal Information: OPA1664
    6. 5.6 Electrical Characteristics: VS = ±15V
    7. 5.7 Electrical Characteristics: VS = 5V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Input Protection
      3. 6.1.3 Noise Performance
      4. 6.1.4 Basic Noise Calculations
      5. 6.1.5 Total Harmonic Distortion Measurements
      6. 6.1.6 Capacitive Loads
      7. 6.1.7 Power Dissipation
      8. 6.1.8 Electrical Overstress
    2. 6.2 Typical Application
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1.7 Power Dissipation

The OPA1662 and OPA1664 series op amps are capable of driving 2kΩ loads with a power-supply voltage up to ±18V and full operating temperature range. Internal power dissipation increases when operating at high supply voltages. Copper leadframe construction used in the OPA166x series op amps improves heat dissipation compared to conventional materials. Circuit board layout can also help minimize junction temperature rise. Wide copper traces help dissipate the heat by acting as an additional heat sink. Temperature rise can be further minimized by soldering the devices to the circuit board rather than using a socket.