SBOS516H September   2010  – June 2024 OPA171 , OPA2171 , OPA4171

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA171
    5. 5.5 Thermal Information: OPA2171
    6. 5.6 Thermal Information: OPA4171
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics: Table of Graphs
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Characteristics
      2. 6.3.2 Common-Mode Voltage Range
      3. 6.3.3 Phase-Reversal Protection
      4. 6.3.4 Capacitive Load and Stability
    4. 6.4 Device Functional Modes
      1. 6.4.1 Common-Mode Voltage Range
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Electrical Overstress
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitive Load and Stability
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information: OPA171

THERMAL METRIC(1)OPA171UNIT
D (SO)DBV (SOT-23)DRL (SOT-553)
8 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance149.5245.8208.1°C/W
RθJC(top)Junction-to-case(top) thermal resistance97.9133.90.1°C/W
RθJBJunction-to-board thermal resistance87.783.642.4°C/W
ψJTJunction-to-top characterization parameter35.518.20.5°C/W
ψJBJunction-to-board characterization parameter89.583.142.2°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistanceN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.