SBOS807E December   2016  – May 2020 OPA187 , OPA2187 , OPA4187

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      OPAx187 Offers Precision Low-Side Current Measurement Capability
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA187
    2.     Pin Functions: OPA2187
    3.     Pin Functions: OPA4187
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA187
    5. 6.5 Thermal Information: OPA2187
    6. 6.6 Thermal Information: OPA4187
    7. 6.7 Electrical Characteristics: High-Voltage Operation
    8. 6.8 Electrical Characteristics: Low-Voltage Operation
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Input Bias Current Clock Feedthrough
      4. 7.3.4 Internal Offset Correction
      5. 7.3.5 EMI Rejection
      6. 7.3.6 Capacitive Load and Stability
      7. 7.3.7 Electrical Overstress
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Discrete INA + Attenuation for ADC With 3.3-V Supply
      3. 8.2.3 Bridge Amplifier
      4. 8.2.4 Low-Side Current Monitor
      5. 8.2.5 Programmable Power Supply
      6. 8.2.6 RTD Amplifier With Linearization
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (December 2018) to E Revision

  • Changed OPA4187 RUM (WQFN) package from preview to production data (active)Go

Changes from C Revision (December 2018) to D Revision

  • Changed OPA4187 SOIC and TSSOP packages from product preview to production dataGo
  • Changed offset drift (high and low supply) max to ±15nV/°CGo

Changes from B Revision (October 2018) to C Revision

  • First release of production OPA187 SOIC deviceGo

Changes from A Revision (July 2017) to B Revision

  • Changed OPA187 SOIC status to previewGo
  • Changed OPA4187 SOIC, TSSOP and WQFN status to previewGo
  • Changed offset drift (high supply) typical from ±5 nV/℃ to ±1 nV/℃ and max from ±50 nV/℃ to ±20 nV/℃ Go
  • Changed input bias current max (high supply) from ±5 nA to ±7.5 nAGo
  • Changed input offset current max (high supply) from ±5 nA to ±14.5 nAGo
  • Changed offset drift (low supply) typical from ±5 nV/℃ to ±1 nV/℃ and max from ±50 nV/℃ to ±20 nV/℃Go
  • Changed Offset Voltage Production Distribution figureGo

Changes from * Revision (December 2016) to A Revision

  • Deleted VSON package option from the DescriptionGo
  • Deleted VSON package option from the Device Information tableGo
  • Added WQFN package option to the Device Information tableGo
  • Deleted OPA187 DRG package option from Pin Configuration and FunctionsGo
  • Added WQFN package to Pin Configuration and FunctionsGo