SBOS642C March   2013  – January 2020 OPA188

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Auto-Zero Technology Provides Ultra-Low Temperature Drift
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Portfolio Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: High-Voltage Operation
    6. 7.6 Electrical Characteristics: Low-Voltage Operation
    7. 7.7 Typical Characteristics: Table of Graphs
      1. 7.7.1 Table of Graphs
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 Phase-Reversal Protection
      3. 8.3.3 Input Bias Current Clock Feedthrough
      4. 8.3.4 Internal Offset Correction
      5. 8.3.5 EMI Rejection
      6. 8.3.6 Capacitive Load and Stability
      7. 8.3.7 Electrical Overstress
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete INA + Attenuation for ADC With 3.3-V Supply
      3. 9.2.3 Bridge Amplifier
      4. 9.2.4 Low-Side Current Monitor
      5. 9.2.5 Programmable Power Supply
      6. 9.2.6 RTD Amplifier With Linearization
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Download Software)
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (September 2016) to C Revision

  • Deleted automotive (Q1) device test conditions from plots in this commercial device data sheet Go

Changes from A Revision (March 2013) to B Revision

  • Added Device Information, Device Comparison, ESD Ratings, and Recommended Operating Conditions tables, and Detailed Description, Applications and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Package Information table; all information now available in the package option addendum at the end of the data sheet Go
  • Changed input bias current maximum value for over-temperature test condition in Electrical CharacteristicsGo
  • Changed input offset current maximum value for over-temperature test condition in Electrical CharacteristicsGo
  • Changed quiescent current values in Electrical CharacteristicsGo
  • Changed input bias current maximum value for over-temperature test condition in Electrical CharacteristicsGo
  • Changed input offset current maximum value for over-temperature test condition in Electrical CharacteristicsGo
  • Changed quiescent current maximum values in Electrical CharacteristicsGo

Changes from * Revision (March 2013) to A Revision

  • Changed document status to Production DataGo