SBOS812H October   2017  – May 2020 OPA202 , OPA2202 , OPA4202

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      OPAx202 Excel Even When Directly Driving Heavy Capacitive Loads
      2.      Input Voltage Noise and Current Noise Spectral Density vs Frequency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA202
    2.     Pin Functions: OPA2202
    3.     Pin Functions: OPA4202
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA202
    5. 6.5 Thermal Information: OPA2202
    6. 6.6 Thermal Information: OPA4202
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Capacitive Load and Stability
      2. 7.3.2 Output Current Limit
      3. 7.3.3 Noise Performance
      4. 7.3.4 Phase-Reversal Protection
      5. 7.3.5 Thermal Protection
      6. 7.3.6 Electrical Overstress
      7. 7.3.7 EMI Rejection
      8. 7.3.8 EMIRR +IN Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Noise Calculations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 WEBENCH Filter Designer Tool
        3. 11.1.1.3 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information: OPA2202

THERMAL METRIC(1) OPA2202 UNIT
DGK (VSSOP) D (SOIC)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 180.1 121.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.3 64.3 °C/W
RθJB Junction-to-board thermal resistance 101.4 65 °C/W
ΨJT Junction-to-top characterization parameter 10.5 18.2 °C/W
ΨJB Junction-to-board characterization parameter 99.8 64.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.