SBOS377L October 2006 – January 2020 OPA211
PRODUCTION DATA.
The OPA211 is offered in an SON-8 package (also known as SON). The SON package is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad.
SON packages are physically small, and have a smaller routing area, improved thermal performance, and improved electrical parasitics. Additionally, the absence of external leads eliminates bent-lead issues.
The SON package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See the QFN/SON PCB Attachment application note and the Quad Flatpack No-Lead Logic Packages application report, both available for download at www.ti.com.
NOTE
The exposed leadframe die pad on the bottom of the package must be connected to V–. Soldering the thermal pad improves heat dissipation and enables specified device performance.
The exposed leadframe die pad on the SON package should be soldered to a thermal pad on the PCB. A mechanical drawing showing an example layout is attached at the end of this data sheet. Refinements to this layout may be necessary based on assembly process requirements. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heat sink area on the PCB.
Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability.