SBOS377L October   2006  – January 2020 OPA211

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Input Voltage Noise Density vs Frequency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA211
    2.     Pin Functions: OPA2211
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA211 and OPA211A
    5. 6.5 Thermal Information: OPA2211 and OPA2211A
    6. 6.6 Electrical Characteristics: Standard Grade OPAx211A
    7. 6.7 Electrical Characteristics: High-Grade OPAx211
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion Measurements
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operating Voltage
      2. 8.1.2 Input Protection
      3. 8.1.3 Noise Performance
      4. 8.1.4 Basic Noise Calculations
      5. 8.1.5 EMI Rejection
      6. 8.1.6 EMIRR +IN Test Configuration
      7. 8.1.7 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 SON Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information: OPA211 and OPA211A

THERMAL METRIC(1) OPA211, OPA211A UNIT
D (SOIC) DRG (SON) DGK (VSSOP)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance, high-K board 122.2 125 184.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.5 N/A 71.2 °C/W
RθJB Junction-to-board thermal resistance 64.3 28.8 104.9 °C/W
ψJT Junction-to-top characterization parameter 14.2 3 11.5 °C/W
ψJB Junction-to-board characterization parameter 63.6 25 103.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 19.1 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.