SBOS054C January   1995  – August 2024 OPA132 , OPA2132 , OPA4132

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA132
    5. 5.5 Thermal Information - OPA2132
    6. 5.6 Thermal Information - OPA4132
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Voltage
      2. 7.1.2 Offset Voltage Trim
      3. 7.1.3 Input Bias Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Analog Filter Designer
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 TI Reference Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision B (September 2015) to Revision C (August 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added information about newer, next-generation OPA2156Go
  • Changed high open-loop gain from 130dB (600Ω load) to 126dB (2kΩ load)Go
  • Deleted all single and quad channel PDIP package references from this data sheetGo
  • Updated Device Information tableGo
  • Updated Pin Configuration and Functions formatGo
  • Changed OPA132 pin 1 and pin 8 from "Offset Trim" to "NC"Go
  • Changed input voltage from (V–) – 0.7 and (V+) + 0.7 to (V–) – 0.5 and (V+) + 0.5 in Absolute Maximum Ratings Go
  • Added input current and related footnote to Absolute Maximum Ratings Go
  • Added Thermal Information Go
  • Changed format of Electrical Characteristics to latest standardGo
  • Updated nominal conditions in the header of Electrical Characteristics Go
  • Added ± to power supply rejection ratio (offset vs temperature) and input bias current valuesGo
  • Changed common-mode voltage MAX value from (V+) – 2.5V to (V+) – 3.5VGo
  • Changed common-mode rejection ratio and common-mode input impedance test conditions from –12.5V ≤ VCM ≤ 12.5V to –12.5V ≤ VCM ≤ 11.5VGo
  • Changed differential input impedance from 1010Ω || 2pF to 1010Ω || 10pFGo
  • Changed common-mode input impedance from 1010Ω || 6pF to 1010Ω || 7pFGo
  • Changed overload recovery time from 0.5µs to 600nsGo
  • Changed overload recovery time test condition from G = ± to G = ±1 to fix typoGo
  • Moved voltage output negative MIN values to MAX valuesGo
  • Deleted redundant power supply and temperature range sections already covered in Recommended Operating Conditions Go
  • Deleted note 1 from Electrical CharacteristicsGo
  • Changed Typical Characteristics header test conditions to match Electrical Characteristics Go
  • Changed Figure 16, Small-Signal Overshoot vs Load Capacitance into two plots, Figure 5-16 for G = +1 and Figure 5-17 for G = –1Go
  • Updated Figure 5-18, Output Voltage Swing vs Output Current Go
  • Updated Functional Block Diagram Go
  • Updated Offset Voltage Trim Go
  • Updated Figure 7-3, OPA132 Layout Example for the Noninverting Configuration Go

Changes from Revision A (June 2004) to Revision B (September 2015)

  • Added ESD Ratings, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo