SBOS516H September   2010  – June 2024 OPA171 , OPA2171 , OPA4171

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA171
    5. 5.5 Thermal Information: OPA2171
    6. 5.6 Thermal Information: OPA4171
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics: Table of Graphs
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Characteristics
      2. 6.3.2 Common-Mode Voltage Range
      3. 6.3.3 Phase-Reversal Protection
      4. 6.3.4 Capacitive Load and Stability
    4. 6.4 Device Functional Modes
      1. 6.4.1 Common-Mode Voltage Range
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Electrical Overstress
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Capacitive Load and Stability
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Support Resources
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.