SBOS807E December   2016  – May 2020 OPA187 , OPA2187 , OPA4187

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      OPAx187 Offers Precision Low-Side Current Measurement Capability
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA187
    2.     Pin Functions: OPA2187
    3.     Pin Functions: OPA4187
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA187
    5. 6.5 Thermal Information: OPA2187
    6. 6.6 Thermal Information: OPA4187
    7. 6.7 Electrical Characteristics: High-Voltage Operation
    8. 6.8 Electrical Characteristics: Low-Voltage Operation
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Input Bias Current Clock Feedthrough
      4. 7.3.4 Internal Offset Correction
      5. 7.3.5 EMI Rejection
      6. 7.3.6 Capacitive Load and Stability
      7. 7.3.7 Electrical Overstress
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Discrete INA + Attenuation for ADC With 3.3-V Supply
      3. 8.2.3 Bridge Amplifier
      4. 8.2.4 Low-Side Current Monitor
      5. 8.2.5 Programmable Power Supply
      6. 8.2.6 RTD Amplifier With Linearization
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information: OPA2187

THERMAL METRIC(1) OPA2187 UNIT
8 PINS
DGK (VSSOP) D (SOIC)
RθJA Junction-to-ambient thermal resistance 159 100.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 37 42.4 °C/W
RθJB Junction-to-board thermal resistance 49 41.0 °C/W
ψJT Junction-to-top characterization parameter 1.2 4.8 °C/W
ψJB Junction-to-board characterization parameter 77.1 40.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.