SBOS850 December   2017 OPA192-Q1 , OPA2192-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA192-Q1
    5. 6.5 Thermal Information: OPA2192-Q1
    6. 6.6 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    7. 6.7 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V)
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Input Offset Voltage Drift
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Protection Circuitry
      2. 8.3.2 EMI Rejection
      3. 8.3.3 Phase Reversal Protection
      4. 8.3.4 Thermal Protection
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 Common-Mode Voltage Range
      7. 8.3.7 Electrical Overstress
      8. 8.3.8 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 16-Bit Precision Multiplexed Data-Acquisition System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Slew Rate Limit for Input Protection
      3. 9.2.3 Precision Reference Buffer
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Software Download)
        2. 12.1.1.2 TI Precision Designs
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

DATE REVISION NOTES
December 2017 * Initial release