SBOS110C May   1998  – March 2023 OPA2227 , OPA2228 , OPA227 , OPA228 , OPA4227 , OPA4228

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA227, OPA228
    5. 6.5 Thermal Information: OPA2227, OPA2228
    6. 6.6 Thermal Information: OPA4227, OPA4228
    7. 6.7 Electrical Characteristics: OPAx227 
    8. 6.8 Electrical Characteristics: OPAx228 
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset Voltage and Drift
      2. 7.3.2 Operating Voltage
      3. 7.3.3 Offset Voltage Adjustment
      4. 7.3.4 Input Protection
      5. 7.3.5 Input Bias Current Cancellation
      6. 7.3.6 Noise Performance
      7. 7.3.7 Basic Noise Calculations
      8. 7.3.8 EMI Rejection Ratio (EMIRR)
        1. 7.3.8.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Using the OPAx228 in Low Gains
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Three-Pole, 20 kHz Low Pass, 0.5-dB Chebyshev Filter
      3. 8.2.3 Long-Wavelength Infrared Detector Amplifier
      4. 8.2.4 High Performance Synchronous Demodulator
      5. 8.2.5 Headphone Amplifier
      6. 8.2.6 Three-Band Active Tone Control (Bass, Midrange, and Treble)
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 9.1.1.2 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Trademarks

TINA-TI™ and TI E2E™ are trademarks of Texas Instruments.

TINA™ is a trademark of DesignSoft, Inc.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc.

All trademarks are the property of their respective owners.