SBOSAA1H
April 2022 – November 2024
OPA2310
,
OPA310
,
OPA4310
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information for Single Channel
6.5
Thermal Information for Dual Channel
6.6
Thermal Information for Quad Channel
6.7
Electrical Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Operating Voltage
7.3.2
Rail-to-Rail Input
7.3.3
Rail-to-Rail Output
7.3.4
Capacitive Load and Stability
7.3.5
Overload Recovery
7.3.6
EMI Rejection
7.3.7
ESD and Electrical Overstress
7.3.8
Input ESD Protection
7.3.9
Shutdown Function
7.3.10
Packages with an Exposed Thermal Pad
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
OPAx310 Low-Side, Current Sensing Application
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DSG|8
MPDS308C
RUG|10
MPQF216A
DGK|8
MPDS028E
Thermal pad, mechanical data (Package|Pins)
DSG|8
QFND141I
Orderable Information
sbosaa1h_oa
sbosaa1h_pm
9.5
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.