SBOS432G August   2008  – August 2016 OPA2330 , OPA330 , OPA4330

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA330
    5. 7.5 Thermal Information: OPA2330
    6. 7.6 Thermal Information: OPA4330
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Operating Voltage
      2. 9.1.2 Input Voltage
      3. 9.1.3 Input Differential Voltage
      4. 9.1.4 Internal Offset Correction
      5. 9.1.5 EMI Susceptibility and Input Filtering
      6. 9.1.6 Achieving Output Swing to the Operational Amplifier Negative Rail
      7. 9.1.7 Photosensitivity
    2. 9.2 Typical Application
      1. 9.2.1 Bidirectional Current-Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 Single Operational Amplifier Bridge Amplifier
      2. 9.3.2 Low-Side Current Monitor
      3. 9.3.3 Thermistor Measurement
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 VQFN and SON Packages
      2. 11.1.2 VQFN and SON Layout Guidelines
      3. 11.1.3 OPA330 DSBGA
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ (Free Software Download)
        2. 12.1.1.2 DIP Adapter EVM
        3. 12.1.1.3 Universal Operational Amplifier EVM
        4. 12.1.1.4 TI Precision Designs
        5. 12.1.1.5 WEBENCH Filter Designer
        6. 12.1.1.6 Related Parts
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison Table

DEVICE NO OF
CHANNELS		 PACKAGE-LEADS
DSBGA SOIC SOT SC70 VSSOP SON VQFN TSSOP
OPA330 1 5 8 5 5 — — — —
OPA2330 2 — 8 — — 8 8 — —
OPA4330 4 — 14 — — — — 14 14