SBOS465C January   2009  – January 2016 OPA2348-Q1 , OPA348-Q1 , OPA4348-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA348-Q1
    5. 6.5 Thermal Information: OPA2348-Q1, OPA4348-Q1
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Input
      4. 7.3.4 Input and ESD Protection
      5. 7.3.5 Common-Mode Rejection Ratio (CMRR)
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 EMI Susceptibility and Input Filtering
      8. 7.3.8 Rail-to-Rail Output
      9. 7.3.9 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving Analog-to-Digital Converters (ADCs)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (December 2014) to C Revision

  • Added the OPA348-Q1 SOIC (D) package option to documentGo

Changes from A Revision (January 2009) to B Revision

  • Added two new applications to the Applications section Go
  • Added the ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added the OPA348-Q1 device to the data sheet Go
  • Changed the name for pin 3 in the PW (TSSOP) package drawingGo