For best operational performance of the device, use good PCB layout practices, including:
- Noise can propagate into analog circuitry through
the power pins of the circuit as a whole and operational amplifier.
Bypass capacitors are used to reduce the coupled noise by providing
low-impedance power sources local to the analog circuitry.
- Connect low-ESR,
0.1-µF ceramic bypass capacitors between each supply pin and
ground, placed as close to the device as possible. A single
bypass capacitor from V+ to ground is applicable for
single-supply applications.
- The OPAx365 are
capable of high-output current (in excess of 65 mA).
Applications with low-impedance loads or capacitive loads with
fast transient signals demand large currents from the power
supplies. Larger bypass capacitors such as 1-µF solid tantalum
capacitors can improve dynamic performance in these
applications.
- Separate grounding for analog and digital
portions of circuitry is one of the simplest and most-effective methods
of noise suppression. One or more layers on multilayer PCBs are usually
devoted to ground planes. A ground plane helps distribute heat and
reduces EMI noise pickup. Make sure to physically separate digital and
analog grounds paying attention to the flow of the ground current.
- To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace.
- Place the external components as close to the
device as possible. As Figure 9-8 shows, keep RF and RG close to the inverting input to minimize
parasitic capacitance.
- Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
- Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.
- For best performance, clean the PCB following
board assembly.
- Any precision integrated circuit can experience
performance shifts due to moisture ingress into the plastic package.
Following any aqueous PCB cleaning process, bake the PCB assembly to
remove moisture introduced into the device packaging during the cleaning
process. A low-temperature, post-cleaning bake at 85°C for 30 minutes is
sufficient for most circumstances.