SBOS925D December 2020 – April 2024 OPA2391 , OPA391 , OPA4391
PRODMIX
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | OPA2391 | UNIT | ||
---|---|---|---|---|
D (SOIC) | YBJ (DSBGA) | |||
8 PINS | 9 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 132.8 | 110.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 72.7 | 0.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 76.3 | 32.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 22.6 | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 75.6 | 32.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |