SBOS075A September   2000  – June 2024 OPA2241 , OPA2251 , OPA241 , OPA251 , OPA4241 , OPA4251

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information for OPA241 and OPA251
    4. 5.4 Thermal Information for OPA2241 and OPA2251
    5. 5.5 Thermal Information for OPA4241 and OPA4251
    6. 5.6 Electrical Characteristics for VS = 2.7V to 5V
    7. 5.7 Electrical Characteristics for VS = ±15V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Applications Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Offset Voltage Trim
      3. 6.1.3 Capacitive Load and Stability
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Electrostatic Discharge Caution

OPA241 OPA2241 OPA4241 OPA251 OPA2251 OPA4251 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.