SBOS690A July   2016  – December 2019 OPA2626

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      SAR ADC Driver
      2.      High Fidelity Topology Improves Dynamic Performance (fIN = 10-kHz, 1-MSPS FFT)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA2626
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: High-Supply
    6. 6.6 Electrical Characteristics: Low-Supply
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 DC Parameter Measurements
    2. 7.2 Transient Parameter Measurements
    3. 7.3 AC Parameter Measurements
    4. 7.4 Noise Parameter Measurements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 SAR ADC Driver
      2. 8.3.2 Electrical Overstress
    4. 8.4 Device Functional Modes
      1. 8.4.1 High-Drive Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Supply, 16-Bit, 1-MSPS SAR ADC Driver
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply, 16-Bit, 1-MSPS, Multiplexed, SAR ADC Driver
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI (Free Software Download)
        2. 12.1.1.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) OPA2626 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 171.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.4 °C/W
RθJB Junction-to-board thermal resistance 91.9 °C/W
ψJT Junction-to-top characterization parameter 9.4 °C/W
ψJB Junction-to-board characterization parameter 90.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.