SBOS382H may   2008  – june 2023 OPA2673

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Family Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Full Bias and Offline Mode VS = ±6 V
    6. 7.6  Electrical Characteristics: 75% Bias Mode VS = ±6 V
    7. 7.7  Electrical Characteristics: 50% Bias Mode VS = ±6 V
    8. 7.8  Typical Characteristics: VS = ±6 V, Full Bias
    9. 7.9  Typical Characteristics: VS = ±6 V Differential, Full Bias
    10. 7.10 Typical Characteristics: VS = ±6 V, 75% Bias
    11. 7.11 Typical Characteristics: VS = ±6 V, 50% Bias
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Suggestions
        1. 8.3.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 8.3.1.2 Output Current and Voltage
        3. 8.3.1.3 Driving Capacitive Loads
        4. 8.3.1.4 Line Driver Headroom Model
        5. 8.3.1.5 Noise Performance
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Speed Active Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 PLC Line Driver
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Thermal Analysis
      2. 9.3.2 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 TINA-TI™ Simulation Software (Free Download)
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-0253FE34-38D4-4685-AEF2-AD5F9668FDB4-low.gifFigure 6-1 RGV Package,
16-Pin VQFN
(Top View)
GUID-20211110-SS0I-NDQ0-P92M-FWMCHL9GXXZV-low.svgFigure 6-2 RGV Package,
16-Pin VQFN
(Bottom View)
Table 6-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
A0 8 Input Bias mode control
A1 9 Input Bias mode control
GND 4 Power Ground
–IN A 2 Input Amplifier A inverting input
+IN A 3 Input Amplifier A noninverting input
–IN B 11 Input Amplifier B inverting input
+IN B 10 Input Amplifier B noninverting input
NC 1, 5, 6, 12, 15 — Do not connect. There is no internal connection. Typically GND is the recommended connection to a heat-spreading plane.
OUT A 16 Output Amplifier A output
OUT B 13 Output Amplifier B output
–VS 7 Power Negative power-supply connection
+VS 14 Power Positive power-supply connection
Thermal Pad — Electrically connected to die substrate and VS–. Connect to VS– on the PCB for best performance.