SBOS079C March   1999  – February 2023 OPA2277 , OPA277 , OPA4277

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA277
    5. 6.5 Thermal Information: OPA2277
    6. 6.6 Thermal Information: OPA4277
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Offset Voltage Adjustment
      3. 7.3.3 Input Protection
      4. 7.3.4 Input Bias Current Cancellation
      5. 7.3.5 EMI Rejection Ratio (EMIRR)
        1. 7.3.5.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Second-Order, Low-Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Load Cell Amplifier
      3. 8.2.3 Thermocouple Low-Offset, Low-Drift Loop Measurement With Diode Cold Junction Compensation
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 DRM Package (8-Pin VSON)
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRM|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Related Documentation

For related documentation, see the following application reports and publications (available for download from www.ti.com):