SBOS309E August   2004  – December 2024 OPA2830

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics VS = ±5V
    6. 6.6  Electrical Characteristics VS = 5V
    7. 6.7  Electrical Characteristics VS = 3V
    8. 6.8  Typical Characteristics: VS = ±5V
    9. 6.9  Typical Characteristics: VS = ±5V, Differential Configuration
    10. 6.10 Typical Characteristics: VS = 5V
    11. 6.11 Typical Characteristics: VS = 5V, Differential Configuration
    12. 6.12 Typical Characteristics: VS = 3V
    13. 6.13 Typical Characteristics: VS = 3V, Differential Configuration
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Wideband Voltage-Feedback Operation
      2. 8.1.2  Single-Supply ADC Interface
      3. 8.1.3  DC Level-Shifting
      4. 8.1.4  AC-Coupled Output Video Line Driver
      5. 8.1.5  Noninverting Amplifier With Reduced Peaking
      6. 8.1.6  Single-Supply Active Filter
      7. 8.1.7  Differential Low-Pass Active Filters
      8. 8.1.8  High-Pass Filters
      9. 8.1.9  High-Performance DAC Transimpedance Amplifier
      10. 8.1.10 Operating Suggestions Optimizing Resistor Values
      11. 8.1.11 Bandwidth vs Gain: Noninverting Operation
      12. 8.1.12 Inverting Amplifier Operation
      13. 8.1.13 Output Current and Voltages
      14. 8.1.14 Driving Capacitive Loads
      15. 8.1.15 Distortion Performance
      16. 8.1.16 Noise Performance
      17. 8.1.17 DC Accuracy and Offset Control
    2. 8.2 Power Supply Recommendations
      1. 8.2.1 Thermal Analysis
    3. 8.3 Layout
      1. 8.3.1 Board Layout Guidelines
        1. 8.3.1.1 Input and ESD Protection
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design-In Tools
        1. 9.1.1.1 Demonstration Fixtures
        2. 9.1.1.2 Macro-model and Applications Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) OPA2830 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 122.6 144.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.2 56.2 °C/W
RθJB Junction-to-board thermal resistance 70.1 77.6 °C/W
ψJT Junction-to-top characterization parameter 11.9 3.9 °C/W
ψJB Junction-to-board characterization parameter 69.2 76.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.