SBOSAB2A february   2023  – july 2023 OPA2863-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Electrical Characteristics: VS = 3 V
    7. 7.7 Typical Characteristics: VS = ±5 V
    8. 7.8 Typical Characteristics: VS = 3 V
    9. 7.9 Typical Characteristics: VS = 3 V to 10 V
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Front-End Gain and Filtering
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.1 Layout Guidelines

Achieving optimum performance with a high-frequency amplifier (like the OPA2863-Q1) requires careful attention to board layout parasitics and external component types. The DEM-OPA-SO-2A Demonstration Fixture user's guide can be used as a reference when designing the circuit board. Recommendations that optimize performance include the following:

  1. Minimize parasitic capacitance to any AC ground for all of the signal I/O pins. Parasitic capacitance on the output and inverting input pins can cause instability—on the noninverting input, parasitic capacitance can react with the source impedance to cause unintentional band-limiting. Open a window around the signal I/O pins in all of the ground and power planes around those pins to reduce unwanted capacitance. Otherwise, ground and power planes must be unbroken elsewhere on the board.
  2. Minimize the distance (< 0.1 in) from the power-supply pins to high-frequency 0.01-µF decoupling capacitors. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. The power-supply connections must always be decoupled with these capacitors. Larger (2.2-µF to 6.8-µF) decoupling capacitors, effective at lower frequency, must also be used on the supply pins. These capacitors can be placed somewhat farther from the device and shared among several devices in the same area of the PCB.
  3. Careful selection and placement of external components preserves the high-frequency performance of the OPA2863-Q1. Resistors must be a low reactance type. Surface-mount resistors work best and allow a tighter overall layout. Other network components, such as noninverting input termination resistors, must also be placed close to the package. Keep resistor values as low as possible and consistent with load-driving considerations. Lowering the resistor values keeps the resistor noise terms low and minimizes the effect of the parasitic capacitance. Lower resistor values, however, increase the dynamic power consumption because RF and RG become part of the amplifier output load network.