SBOSAI7B November   2023  – July 2024 OPA2891 , OPA891

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA891
    5. 5.5 Thermal Information - OPA2891
    6. 5.6 Electrical Characteristics - RL = 150Ω
    7. 5.7 Electrical Characteristics - RL = 1kΩ
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Offset Nulling
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a Capacitive Load
      2. 7.1.2 Low-Pass Filter Configurations
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selection of Multiplexer
        2. 7.2.2.2 Signal Source
        3. 7.2.2.3 Driving Amplifier
        4. 7.2.2.4 Driving Amplifier Bandwidth Restriction
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 General PowerPAD™ Integrated Circuit Package Design Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)

9 Revision History

Changes from Revision A (June 2024) to Revision B (July 2024)

  • Changed OPA2891 status from preview information to production data (active)Go
  • Added thermal pad information to Tables 4-1 and 4-2Go
  • Updated Thermal Information: OPA2891 for the D and DGN packagesGo
  • Deleted Supply voltage from Electrical Characteristics as included in Recomended Operating Conditions Go

Changes from Revision * (November 2023) to Revision A (June 2024)

  • Deleted erroneous VO test condition for IMD in Electrical Characteristics - THS4031, RL = 1kΩ Go
  • Changed unit from µA to nA for Input offset current in Electrical Characteristics - RL = 1kΩ Go
  • Changed gain from +2V/V to +1V/V in Typical Characteristics Go
  • Changed abscissa axis label of Figure 5-23, 20V Step Response, from 10ns/div to 100ns/divGo