SBOSA12H March   2020  – March 2024 OPA2991-Q1 , OPA4991-Q1 , OPA991-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (October 2023) to Revision H (March 2024)

  • Deleted preview note from 5-pin SC70 (DCK) and 6-pin SOT-23 (DBV) packagesGo
  • Added HBM ESD rating for OPA991SQDBVRQ1Go
  • Changed the schematic and VSSOP-8 (DGK) layout in the Layout Example sectionGo
  • Added the SC70 (DCK) layout to the Layout Example sectionGo

Changes from Revision F (June 2023) to Revision G (October 2023)

  • Added 5-pin SC70 (DCK) and 6-pin SOT-23 (DBV) information throughout data sheetGo

Changes from Revision E (April 2023) to Revision F (June 2023)

  • Changed the status of the TSSOP (8) package from: preview to: active Go
  • Updated the format of the Device Information tableGo

Changes from Revision D (September 2021) to Revision E (April 2023)

  • Added the TSSOP (8) package in Package Information tableGo

Changes from Revision C (May 2021) to Revision D (September 2021)

  • Deleted preview note from SOIC (14) package in Device Information tableGo
  • Deleted preview note from SOT-23 (14) package in Device Information tableGo
  • Deleted preview note from SOIC (8) package in Device Information tableGo
  • Deleted preview note from SOT-23 (5) package in Device Information tableGo

Changes from Revision B (March 2021) to Revision C (May 2021)

  • Deleted preview note from TSSOP (14) package in Device Information tableGo

Changes from Revision A (December 2020) to Revision B (March 2021)

  • Changed data sheet status from "Advance Information" to "Production Data"Go
  • Deleted preview note from VSSOP (8) package in Device Information tableGo

Changes from Revision * (March 2020) to Revision A (December 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added link to all applications in Applications sectionGo
  • Deleted SOT-23 (8) package from Device Information in the Description sectionGo
  • Added SOT-23 (14) package to Device Information in the Description sectionGo
  • Deleted Table of Graphs from the Specifications sectionGo
  • Added additional references in Related Documentation sectionGo