SBOSA12H March   2020  – March 2024 OPA2991-Q1 , OPA4991-Q1 , OPA991-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Protection Circuitry
      2. 6.3.2  EMI Rejection
      3. 6.3.3  Thermal Protection
      4. 6.3.4  Capacitive Load and Stability
      5. 6.3.5  Common-Mode Voltage Range
      6. 6.3.6  Phase Reversal Protection
      7. 6.3.7  Electrical Overstress
      8. 6.3.8  Overload Recovery
      9. 6.3.9  Typical Specifications and Distributions
      10. 6.3.10 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.3 Thermal Protection

The internal power dissipation of any amplifier causes its internal (junction) temperature to rise. This phenomenon is called self heating. The absolute maximum junction temperature of the OPAx991-Q1 is 150°C. Exceeding this temperature causes damage to the device. The OPAx991-Q1 has a thermal protection feature that reduces damage from self heating. The protection works by monitoring the temperature of the device and turning off the op amp output drive for temperatures above 170°C. Figure 6-4 shows an application example for the OPAx991-Q1 that has significant self heating because of its power dissipation (0.81 W). Thermal calculations indicate that for an ambient temperature of 65°C, the device junction temperature will reach 177°C. The actual device, however, turns off the output drive to recover towards a safe junction temperature. Figure 6-4 shows how the circuit behaves during thermal protection. During normal operation, the device acts as a buffer so the output is 3 V. When self heating causes the device junction temperature to increase above the internal limit, the thermal protection forces the output to a high-impedance state and the output is pulled to ground through resistor RL. If the condition that caused excessive power dissipation is not removed, the amplifier will oscillate between a shutdown and enabled state until the output fault is corrected.

GUID-20230413-SS0I-FLQJ-1RSG-X2K59LMHP032-low.svg Figure 6-4 Thermal Protection

If the device continues to operate at high junction temperatures with high output power over a long period of time, regardless if the device is or is not entering thermal shutdown, the thermal dissipation of the device can slowly degrade performance of the device and eventually cause catastrophic destruction. Designers should be careful to limit output power of the device at high temperatures, or control ambient and junction temperatures under high output power conditions.