SBOSAC9E August 2022 – July 2024 OPA2992-Q1 , OPA4992-Q1 , OPA992-Q1
PRODUCTION DATA
THERMAL METRIC(1) | OPA2992-Q1 | Unit | |||
---|---|---|---|---|---|
D (SOIC) |
PW (TSSOP) |
DGK (VSSOP) |
|||
8 PINS | 8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 130.8 | 159.1 | 173.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 74.0 | 67.9 | 65.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 74.3 | 98.1 | 95.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 25.8 | 9.1 | 10.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 73.5 | 96.7 | 94.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |