SBOSAG6 November   2023 OPA2994-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Electrical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Unlimited Capacitive Load Drive
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Common-Mode Voltage Range
      4. 6.3.4 Phase Reversal Protection
      5. 6.3.5 Electrical Overstress
      6. 6.3.6 Overload Recovery
      7. 6.3.7 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MINMAXUNIT
Supply voltage, VS = (V+) – (V–)024V
Signal input pinsCommon-mode voltage(3)(V–) – 0.5(V+) + 0.5V
Differential voltage(4)±0.5V
Current(3)±10mA
Output short-circuit(2)Continuous
Operating ambient temperature, TA–55150°C
Junction temperature, TJ150°C
Storage temperature, Tstg–65150°C
(1) Operating the device beyond the ratings listed under Absolute Maximum Ratings will cause permanent damage to the device. These are stress ratings only, based on process and design limitations, and this device has not been designed to function outside the conditions indicated under Recommended Operating Conditions. Exposure to any condition outside Recommended Operating Conditions for extended periods, including absolute-maximum-rated conditions, may affect device reliability and performance.
(2) Short-circuit to ground, one amplifier per package. Extended short-circuit current, especially with higher supply voltage, can cause excessive heating and eventual destruction.
(3) Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less.
(4) Input pins are connected by back-to-back diodes for input protection. If the differential input voltage may exceed 0.5 V, limit the input current to 10 mA or less.