SBOSAI0B December   2023  – September 2024 OPA310-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Voltage
      2. 6.3.2 Rail-to-Rail Input
      3. 6.3.3 Rail-to-Rail Output
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 Overload Recovery
      6. 6.3.6 EMI Rejection
      7. 6.3.7 ESD and Electrical Overstress
      8. 6.3.8 Input ESD Protection
      9. 6.3.9 Shutdown Function
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 OPAx310-Q1 Low-Side, Current Sensing Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4.     Trademarks
    5. 8.4 Electrostatic Discharge Caution
    6. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DBV|6
  • DCK|5
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information for Quad Channel

THERMAL METRIC (1) OPA4310-Q1 UNIT
D 
(SOIC)		 PW 
(TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 101.5 128.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 57.8 58.7 °C/W
RθJB Junction-to-board thermal resistance 58.0 71.4 °C/W
ψJT Junction-to-top characterization parameter 20.9 13.0 °C/W
ψJB Junction-to-board characterization parameter 57.6 70.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.