SBOSAE8B October   2023  – April 2024 OPA2323 , OPA323 , OPA4323

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Voltage
      2. 7.3.2  Rail-to-Rail Input
      3. 7.3.3  Rail-to-Rail Output
      4. 7.3.4  Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5  Capacitive Load and Stability
      6. 7.3.6  Overload Recovery
      7. 7.3.7  EMI Rejection
      8. 7.3.8  ESD and Electrical Overstress
      9. 7.3.9  Input ESD Protection
      10. 7.3.10 Shutdown Function
      11. 7.3.11 Packages with an Exposed Thermal Pad
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 OPAx323 in Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4.     Trademarks
    5. 9.4 Electrostatic Discharge Caution
    6. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (November 2023) to Revision B (April 2024)

  • Changed the status of the DGK (VSSOP, 8), DDF (SOT23-THN) OPA2323 and DYY (SOT23-THN) OPA4323 from: preview to active Go
  • Changed the CMRR value in the data sheet title from 100dB to 114dB Go
  • Changed the DYY (SOT-23) package option from 16 to 14 pins and moved the package from OPA4323S to OPA4323 in Device Information tableGo
  • Changed the DYY (SOT-23) package option from 16 to 14 pins and moved the package from OPA4323S to OPA4323 in Device Comparison tableGo
  • Removed OPA4310 information from the data sheetGo
  • Changed the Typical Characteristics section to add more plots.Go
  • Changed the Rail-to-Rail input section.Go
  • Changed the EMIRR Testing plot in EMI Rejection section.Go
  • Changed the EMIRR IN+ values for the 900MHz, 1.8GHz, 2.4GHz, 3.6GHz, and 5GHz frequency options in OPAx323 EMIRR IN+ for Frequencies of Interest tableGo

Changes from Revision * (October 2023) to Revision A (November 2023)

  • Changed the status of the DCK (SC70, 5) OPA323 from: preview to: active Go
  • Changed the status of the D (SOIC, 8) OPA2323 from: preview to: active Go