SBOS235F March   2002  – April 2018 OPA2357 , OPA357

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = +2.7-V to +5.5-V Single-Supply
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  OPAx357 Comparison
      2. 7.3.2  Operating Voltage
      3. 7.3.3  Enable Function
      4. 7.3.4  Rail-to-Rail Input
      5. 7.3.5  Rail-to-Rail Output
      6. 7.3.6  Output Drive
      7. 7.3.7  Video
      8. 7.3.8  Wideband Video Multiplexing
      9. 7.3.9  Driving Analog-to-Digital Converters
      10. 7.3.10 Capacitive Load and Stability
      11. 7.3.11 Wideband Transimpedance Amplifier
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Transimpedance Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 OPAx357 Design Procedure
            1. 8.2.1.2.2.1 Optimizing the Transimpedance Circuit
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High-Impedance Sensor Interface
      3. 8.2.3 Driving ADCs
      4. 8.2.4 Active Filter
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (May 2009) to F Revision

  • Added Device Information table, Pin Functions table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Overview section, Functional Block Diagram section, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed MSOP to VSSOP throughout document Go
  • Deleted DDA package (SO-8 PowerPAD) from document Go
  • Changed MSOP to VSSOP throughout document Go
  • Added WEBENCH Features bullet Go
  • Deleted OADI from DBV pin drawingGo
  • Deleted Package/Ordering Information tableGo
  • Deleted footnote from Signal input pins parameter in Absolute Maximum Ratings tableGo
  • Changed Temperature Range section of Electrical Characteristics table: changed θJA to RθJA and deleted Specified range, Operating range, and Storage range parametersGo
  • Added OPAx357 Comparison section and moved OPAx357 Related Products table to this section from page 1Go
  • Deleted first paragraph of Power Dissipation sectionGo
  • Changed PCB Layout title to Layout GuidelinesGo
  • Deleted PowerPAD Thermall Enhanced Package and PowerPAD Assembly Process sectionsGo
  • Added Custom Design With WEBENCH® Tools sectionGo