SBOS886E November   2017  – August 2021 OPA2375 , OPA375

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics: OPA375
    8. 7.8 Typical Characteristics: OPA2375
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 THD + Noise Performance
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
      5. 8.3.5 Electrical Overstress
      6. 8.3.6 Typical Specifications and Distributions
      7. 8.3.7 Shutdown Function
      8. 8.3.8 Packages With an Exposed Thermal Pad
      9. 8.3.9 Common Mode Voltage Range
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single-Supply Electret Microphone Preamplifier With Speech Filter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (February 2021) to Revision E (August 2021)

  • Changed OPA2375 VSSOP (DGK) package from Preview to Active Go
  • Removed preview tag for the VSSOP (DGK) package in the Device Comparison Table sectionGo
  • Added VSSOP Package thermal data for OPA2375 in the Thermal Information for Dual Channel sectionGo

Changes from Revision C (June 2020) to Revision D (February 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Operating temperature from 125 to 150  in Absolute Maximum Ratings Go
  • Added Junction temperature spec to Absolute Maximum Ratings Go
  • Removed OPA375 Table of Graphs and OPA2375 Table of Graphs tables from the Specifications sectionGo
  • Removed Related Links section from the Device and Documentation Support sectionGo

Changes from Revision B (January 2020) to Revision C (June 2020)

  • Changed OPA2375S X2QFN (RUG) package from Preview to Active Go
  • Added X2QFN Package Drawing and Pin Functions for OPA2375S in Pin Configuration and Functions sectionGo
  • Changed typical input current noise density value from 2 fA√HZ to 23 fA√HzGo
  • Changed total supply voltage total from 5V to 5.5V in Electrical Characteristics condition statementGo
  • Deleted "Vs = 2.25 V to 5.5 V" test conditions for common-mode rejection ratio parameter in Electrical Characteristics Go

Changes from Revision A (January 2019) to Revision B (January 2020)

  • Changed Low Broadband Noise specification in Features section to match OPA2375 specification Go
  • Added THD+N specification to Features sectionGo
  • Added IQ definition for OPA2375 and OPA4375 in Features sectionGo
  • Added supply range definition for OPA2375 and OPA4375 in Features sectionGo
  • Changed Noise Spectral Density vs Frequency plot on front page to the OPA2375 noise plotGo
  • Changed wording in Description section to reflect the whole OPAx375 familyGo
  • Added OPA2375 devices to Device Information tableGo
  • Added Device Comparison Table sectionGo
  • Added pin out drawings for OPA2375 packages in Pin Configuration and Functions sectionGo
  • Added pin functions for OPA2375 packagesGo
  • Changed  Human-body model (HBM) value from: ±1000 to ±3000 and Charged-device mode (CDM) value from ±250 to ±1000Go
  • Added OPA2375 typical characteristic graphs in the Specifications sectionGo
  • Added EMI Rejection section with description information to Detailed Description sectionGo
  • Added Electrical Overstress section and diagram to Detailed Description sectionGo
  • Added Typical Specification and Distributions section to Detailed Description sectionGo
  • Added Shutdown Function section with description for OPAx375S to Detailed Description sectionGo
  • Added Packages With an Exposed Thermal Pad section to Detailed Description sectionGo
  • Added dual channel layout example in the Layout sectionGo

Changes from Revision * (November 2017) to Revision A (January 2019)

  • Added maximum input offset voltage drift specification in Electrical Characteristics Go