SBOS406G June   2007  – December 2015 OPA2376 , OPA376 , OPA4376

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA376
    5. 6.5 Thermal Information: OPA2376
    6. 6.6 Thermal Information: OPA4376
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Offset Voltage and Input Offset Voltage Drift
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 Common-Mode Voltage Range
      5. 7.3.5 Input and ESD Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Amplifier Configurations
      2. 8.1.2 Active Filtering
      3. 8.1.3 Driving an Analog-to-Digital Converter
      4. 8.1.4 Phantom-Powered Microphone
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Detailed Design Procedure
      2. 8.2.2 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Photosensitivity
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
        3. 11.1.1.3 WEBENCH® Filter Designer
    2. 11.2 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (March 2013) to G Revision

  • Added ESD Ratings, Thermal Information, Recommended Operating Conditions, Power Supply Recommendations, and Device and Documentation Support sections; existing sections may have movedGo
  • Changed WCSP to DSBGA and MSOP to VSSOP throughout data sheetGo
  • Changed dimensions shown in YZD package pinout figureGo

Changes from E Revision (January 2013) to F Revision

  • Changed unit (typo) for Quiescent Current feature bulletGo
  • Changed TSSOP-14 pinout for OPA4376Go

Changes from D Revision (August 2010) to E Revision

  • Changed rail-to-rail feature bullet to show input and outputGo
  • Changed description text to show rail-to-rail input and outputGo

Changes from C Revision (October 2008) to D Revision