SBOS984G November   2020  – September 2023 OPA2387 , OPA387 , OPA4387

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA387
    5. 6.5 Thermal Information: OPA2387
    6. 6.6 Thermal Information: OPA4387
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Bias Current
      2. 7.3.2 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Zero-Drift Clocking
    2. 8.2 Typical Applications
      1. 8.2.1 Bidirectional Current Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Load Cell Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (February 2022) to Revision G (September 2023)

  • Changed OPA2387 D (SOIC-8) package status from preview to production data (active) and added associated thermal informationGo
  • Changed short-circuit current for OPA2387DGK at VS = 1.7 V from ±25 mA to ±15 mAGo

Changes from Revision E (December 2021) to Revision F (February 2022)

  • Added OPA2387 DSG (WSON-8) package and associated contentGo

Changes from Revision D (October 2021) to Revision E (December 2021)

  • Changed OPA4387 device from advanced information (preview) to production data (active)Go

Changes from Revision C (October 2021) to Revision D (October 2021)

  • Added OPA4387 advanced information (preview) device and associated contentGo
  • Changed low-input bias current Features bullet from 135 pA to 150 pAGo
  • Deleted input offset voltage MAX values for over temperature and common-mode voltage test conditions for clarityGo
  • Added input offset voltage over temperature TYP value to represent performance shown in typical characteristics Go
  • Changed maximum input bias current for OPA387 and OPA2387 from 135 pA to 150 pAGo
  • Changed maximum input offset current for OPA387 and OPA2387 from 270 pA to 300 pAGo
  • Changed maximum open-loop voltage gain for OPA387 and OPA2387 from 132 dB to 135 dBGo
  • Changed settling time to 0.01% from 2.5 µs to 5.5 µsGo
  • Changed high linearity output swing from rail for RL = 2 kΩ from 75 mV to 150 mV Go
  • Changed short-circuit current for OPA387 at Vs = 1.7 V from ±25 mA to ±15 mA  Go
  • Added open-loop output impedance at 1 MHz Go
  • Changed Figure 6-13, PSRR and CMRR vs Frequency, to fit to CMRR and PSRR specifications in the Electrical Characteristic table Go
  • Changed Figure 6-24, Phase Margin vs Capacitive Load, to add test conditionGo