SBOS053B May   1998  – May 2024 OPA130 , OPA2130 , OPA4130

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information - OPA130
    4. 5.4 Thermal Information - OPA2130
    5. 5.5 Thermal Information - OPA4130
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Offset Voltage Trim
      3. 6.1.3 Input Bias Current
    2. 6.2 Typical Application
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information - OPA130

THERMAL METRIC(1) OPA130 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 150 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 74 °C/W
RθJB Junction-to-board thermal resistance 62 °C/W
ΨJT Junction-to-top characterization parameter 19.7 °C/W
ΨJB Junction-to-board characterization parameter 54.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.