SBOS040B November   1994  – July 2024 OPA131 , OPA2131 , OPA4131

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information - OPA131
    4. 5.4 Thermal Information - OPA2131
    5. 5.5 Thermal Information - OPA4131
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Offset Voltage Trim
    2. 6.2 Typical Application
      1. 6.2.1 Input Bias Current
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DW|16
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information - OPA4131

THERMAL METRIC(1) OPA4131 UNIT
D (SOIC) DW (SOIC) N (PDIP)
14 PINS 16 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 110 110 80 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56 N/A N/A °C/W
RθJB Junction-to-board thermal resistance 53 N/A N/A °C/W
ΨJT Junction-to-top characterization parameter 19 N/A N/A °C/W
ΨJB Junction-to-board characterization parameter 46 N/A N/A °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.