SBOS584E November   2011  – June 2018 OPA180 , OPA2180 , OPA4180

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Low Noise (Peak-to-Peak Noise = 250 nV)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: OPA180
    3.     Pin Functions: OPA2180
    4.     Pin Functions: OPA4180
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA180
    5. 7.5 Thermal Information: OPA2180
    6. 7.6 Thermal Information: OPA4180
    7. 7.7 Electrical Characteristics: VS = ±2 V to ±18 V (VS = 4 V to 36 V)
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Characteristics
      2. 8.3.2 EMI Rejection
      3. 8.3.3 Phase-Reversal Protection
      4. 8.3.4 Capacitive Load and Stability
      5. 8.3.5 Electrical Overstress
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Bipolar ±10-V Analog Output from a Unipolar Voltage Output DAC
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Component Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete INA + Attenuation
      3. 9.2.3 RTD Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information: OPA180

THERMAL METRIC(1) OPA180 UNIT
D (SOIC) DBV (SOT-23) DGK (MSOP)
8 PINS 5 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 115.8 158.8 180.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 60.1 60.7 67.9 °C/W
RθJB Junction-to-board thermal resistance 56.4 44.8 102.1 °C/W
ψJT Junction-to-top characterization parameter 12.8 1.6 10.4 °C/W
ψJB Junction-to-board characterization parameter 55.9 4.2 100.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.