SBOS584E November 2011 – June 2018 OPA180 , OPA2180 , OPA4180
PRODUCTION DATA.
THERMAL METRIC(1) | OPA2180 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGK (MSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 111 | 159.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 54.9 | 37.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 51.7 | 48.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 9.3 | 1.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 51.1 | 77.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |