SBOS968C
june 2022 – july 2023
OPA186
,
OPA2186
,
OPA4186
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information: OPA186
6.5
Thermal Information: OPA2186
6.6
Thermal Information: OPA4186
6.7
Electrical Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Rail-to-Rail Inputs
7.3.2
Phase-Reversal Protection
7.3.3
Input Bias Current Clock Feedthrough
7.3.4
EMI Rejection
7.3.4.1
EMIRR +IN Test Configuration
7.3.5
Electrical Overstress
7.3.6
MUX-Friendly Inputs
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Basic Noise Calculations
8.2
Typical Applications
8.2.1
High-Side Current Sensing
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
Bridge Amplifier
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.1.1.1
PSpice® for TI
9.1.1.2
TINA-TI™ Simulation Software (Free Download)
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|14
MPDS177H
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos968c_oa
sbos968c_pm
9
Device and Documentation Support