SBOS701D December   2015  – August 2021 OPA191 , OPA2191 , OPA4191

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA191
    5. 6.5 Thermal Information: OPA2191
    6. 6.6 Thermal Information: OPA4191
    7. 6.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    8. 6.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V)
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Input Offset Voltage Drift
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Protection Circuitry
      2. 8.3.2 EMI Rejection
      3. 8.3.3 Phase Reversal Protection
      4. 8.3.4 Thermal Protection
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 Common-Mode Voltage Range
      7. 8.3.7 Electrical Overstress
      8. 8.3.8 Overload Recovery
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-side Current Measurement
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 16-Bit Precision Multiplexed Data-Acquisition System
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Slew Rate Limit for Input Protection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA-TI™ SImulation Software (Free Download)
        2. 12.1.1.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Protection

The internal power dissipation of any amplifier causes the internal (junction) temperature to rise. This phenomenon is called self heating. The OPAx191 has a thermal protection feature that prevents damage from self heating.

This thermal protection works by monitoring the temperature of the output stage and turning off the op amp output drive for temperatures above approximately 180°C. Thermal protection forces the output to a high-impedance state. The OPAx191 is also designed with approximately 30°C of thermal hysteresis. Thermal hysteresis prevents the output stage from cycling in and out of the high-impedance state. The OPAx191 returns to normal operation when the output stage temperature falls below approximately 150°C.

The absolute maximum junction temperature of the OPAx191 is 150°C. Exceeding the limits shown in Section 6.1 may cause damage to the device. Thermal protection triggers at 180°C because of unit-to-unit variance, but does not interfere with device operation up to the absolute maximum ratings. This thermal protection is not designed to prevent this device from exceeding absolute maximum ratings, but rather from excessive thermal overload.