SBOS737C January   2016  – March 2018 OPA197 , OPA2197 , OPA4197

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      OPA197 in a High-Voltage, Multiplexed, Data-Acquisition System
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: OPA197
    2.     Pin Functions: OPA2197 and OPA4197
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA197
    5. 6.5 Thermal Information: OPA2197
    6. 6.6 Thermal Information: OPA4197
    7. 6.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    8. 6.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V)
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Phase Reversal Protection
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Capacitive Load and Stability
      6. 7.3.6 Common-Mode Voltage Range
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 16-Bit Precision Multiplexed Data-Acquisition System
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Slew Rate Limit for Input Protection
      3. 8.2.3 Precision Reference Buffer
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information: OPA197

THERMAL METRIC(1)OPA197UNIT
D (SOIC) DBV (SOT)DGK (VSSOP)
8 PINS 5 PINS8 PINS
RθJA Junction-to-ambient thermal resistance 115.8 158.8 180.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 60.1 60.7 67.9 °C/W
RθJB Junction-to-board thermal resistance 56.4 44.8 102.1 °C/W
ψJT Junction-to-top characterization parameter 12.8 1.6 10.4 °C/W
ψJB Junction-to-board characterization parameter 55.9 4.2 100.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.