SBOSA11E March   2020  – December 2023 OPA206 , OPA2206 , OPA4206

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA206
    5. 5.5 Thermal Information: OPA2206
    6. 5.6 Thermal Information: OPA4206
    7. 5.7 Electrical Characteristics: VS = ±5 V
    8. 5.8 Electrical Characteristics: VS = ±15 V
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Typical Specifications and Distributions
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Overvoltage Protection
      2. 7.3.2 Input Offset Trimming
      3. 7.3.3 Lower Input Bias With Super-Beta Inputs
      4. 7.3.4 Overload Power Limiter
      5. 7.3.5 EMI Rejection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Voltage Attenuator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier
      3. 8.2.3 Input Buffer and Protection for ADC Driver
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2 Input Offset Trimming

The OPAx206 are the industry's first e-trim operational amplifiers built on a bipolar process. The input offset voltage of an amplifier is determined by the inherent mismatch between the input transistors. The offset can be minimized using laser-trimming performed during the manufacturing process while the device is still in the bare silicon form. However, when the silicon is packaged, the packaging process introduces additional offset due to mechanic stresses. TI's new trimming processes are used to trim the offset after the packaging process is complete to minimize both inherent and package-induced offsets. After trimming, communication is disabled to make sure the amplifier operates properly in the final system.

A comparison between production offset values for a the industry popular, laser-trimmed OPA2277 amplifier and the OPAx206 proprietary trim can be seen in Figure 7-3 and Figure 7-4.

GUID-2D224AF4-6C85-4FA6-83CE-D3FA887A69C5-low.gifFigure 7-3 OPA2277 Laser-Trimmed Operational Amplifier Offset
GUID-20210323-CA0I-90KD-FQ3F-FXR1QVPW6MWB-low.pngFigure 7-4 OPAx206 e-trim™ Operational Amplifier Offset

The OPAx206 also features exceptional input offset voltage drift over temperature. Figure 7-5 shows the final performance of the offset drift.


GUID-20230320-SS0I-WF5Q-HSF9-7QB2HK1FQPVW-low.svg
Figure 7-5 OPAx206 e-trim™ Operational Amplifier Drift